
1280×800 · 1000 cd/m²
LVDS 6/8-bit, 40-pin
No TP
Compare a 1000-nit 1280×800 module without touch, an 850-nit 1280×800 PCAP bonded assembly and a 1000-nit 1920×1200 PCAP bonded assembly. Each is a distinct configuration for host and enclosure review.
Module selection for OEM equipment, not a finished monitor or plug-and-play display kit.
| Model | Size / resolution | Panel / luminance | Display interface | Touch / bonding | Operating range |
|---|---|---|---|---|---|
| DS-T101HIEWA-01 | 10.1 inch 1280×800 | IPS 1000 cd/m² | LVDS 6/8-bit, 40-pin | No TP | −30 to +85 °C |
| DS-T101HIEWA-01CP | 10.1 inch 1280×800 | IPS 850 cd/m² | LVDS 6/8-bit, 40-pin | CTP / PCAP Optical bonding | −30 to 85 °C |
| DS-T101BFHA-01CP | 10.1 inch 1920×1200 | IPS 1000 cd/m² | LVDS 2-channel, 8-bit, 45-pin | CTP / PCAP Optical bonding | −20 to 70 °C |
Luminance belongs to the exact listed configuration. It is not a finished-system sunlight-readability, sealing, EMC or safety certification. “No TP” means no integrated touch panel is documented.

LVDS 6/8-bit, 40-pin
No TP

LVDS 6/8-bit, 40-pin
CTP / PCAP · Optical bonding

LVDS 2-channel, 8-bit, 45-pin
CTP / PCAP · Optical bonding
DS-T101HIEWA-01 lists 1000 cd/m², LVDS 6/8-bit 40-pin and −30 to +85 °C operation. Its module outline is not the same as the bonded CP assembly.
DS-T101HIEWA-01CP lists 850 cd/m², PCAP with ILI2511 and optical bonding. It retains a 40-pin LVDS display interface and −30 to 85 °C operation. Confirm the separate touch connection from current documentation.
DS-T101BFHA-01CP lists 1000 cd/m² with dual-channel 8-bit LVDS, 45-pin. Its −20 to 70 °C operating range differs from the 1280×800 wide-temperature models.
A 10.1-inch capacitive touch LCD module needs separate verification of display timing, touch-controller communication, cover-glass outline and installed optical performance. Review PCAP and optical-bonding configurations rather than combining specifications from separate products.
Compare UI needs, host bandwidth and the separately documented connector and temperature boundaries.
Explore this selection path →Bring glove, water, cover-lens and EMC requirements into sample validation.
Explore this selection path →Review sunlight, thermal load, touch behavior and system-level enclosure protection.
Explore this selection path →| Model | Published outline | Active area | Storage range | Drawing |
|---|---|---|---|---|
| DS-T101HIEWA-01 | 229.46×149.10×4.80 mm (8.15 mm max) | 216.96×135.60 mm | −30 to +85 °C | View mechanical reference |
| DS-T101HIEWA-01CP | 260.00×170.00×6.95 mm | 216.96×135.60 mm | −30 to 85 °C | View mechanical reference |
| DS-T101BFHA-01CP | 260.00×170.00×6.73 mm | 216.81×135.50 mm | −30 to 80 °C | View mechanical reference |
Dimensions describe different bare-module or PCAP assemblies. Use the approved drawing for orientation, maximum depth, tolerances, FPC routing and protrusions; matching diagonal size is not proof of interchangeability.
No. DS-T101HIEWA-01 is documented at 1000 cd/m² without touch; DS-T101HIEWA-01CP is documented at 850 cd/m² with PCAP and optical bonding. They are different assemblies.
Do not assume this. DS-T101BFHA-01CP uses dual-channel 8-bit LVDS with 45 pins, while the listed 1280×800 models use LVDS 6/8-bit with 40 pins. Verify pinout, timing, bandwidth and source support.
No. The bonded module is one component. Reflection, sealing, solar load, touch behavior and the complete device environmental requirements need separate validation.
Send the model or required size, host platform and interface, enclosure drawing, viewing condition, operating range, touch requirement, sample quantity and expected demand. Current documentation and sample availability are confirmed during review.