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10.1 inch1280×800IPS850 cd/m²PCAPOptical bonding
DS-T101HIEWA-01CP

10.1-Inch 1280×800 850-Nit Optically Bonded PCAP TFT for HMI

DS-T101HIEWA-01CP combines a 10.1-inch 1280×800 IPS panel, 850 cd/m² luminance, PCAP touch and optical bonding for industrial HMI integration.

ModelDS-T101HIEWA-01CP
Size10.1 inch
Resolution1280×800
PanelIPS
Luminance850 cd/m²
TouchPCAP

Confirm the current datasheet, pinout and approved mechanical drawing before design-in.

Verified product facts

DS-T101HIEWA-01CP specification

ItemDS-T101HIEWA-01CP
Diagonal size10.1 inch
Resolution1280×800
LCD typeIPS
Luminance850 cd/m²
Module interfaceLVDS 6/8-bit, 40-pin
LCD driver ICEK79202
Touch panelCTP / PCAP
Touch controllerILI2511
Bonding typeOptical bonding
Active area (W×H)216.96×135.60 mm
Module outline (W×H×D)260.00×170.00×6.95 mm
Operating temperature−30 to 85 °C
Storage temperature−30 to 85 °C
Module views

Complete module and FPC references.

Front reference view of DS-T101HIEWA-01CP 10.1-inch PCAP TFT LCD with touch and LCD FPC assemblies

Front assembly reference

Black PCAP cover glass and both FPC assemblies are visible.

Angled reference view of DS-T101HIEWA-01CP 10.1-inch PCAP industrial TFT LCD

Angled module view

Use the approved drawing for mounting, connector routing and tolerances.

Rear reference view of DS-T101HIEWA-01CP showing the metal backplate and FPC assemblies

Rear view

Use current approved mechanical and electrical documentation for design details.

PCAP and FPC detail

The touch FPC and LCD interface assembly are shown for visual orientation. Verify the approved drawing, pinout and keep-out zones before tooling.

DS-T101HIEWA-01CP PCAP touch FPC and LCD interface assembly detail

Application concept

Illustrative industrial HMI concept only; it is not a documented customer deployment or mechanical integration drawing.

Illustrative industrial HMI application concept for a 10.1-inch PCAP TFT LCD
Mechanical reference

Outline, PCAP stack and FPC reference drawing.

Use the current approved drawing for production release, tolerances and keep-out zones.

Engineering selection

When should DS-T101HIEWA-01CP be shortlisted?

Shortlist this verified configuration when the project boundary calls for a 10.1-inch 1280×800 IPS display, an 850 cd/m² target, integrated PCAP touch, optical bonding and the documented 40-pin LVDS connection. The final decision still depends on the host, enclosure, light and temperature conditions.

Review industrial HMI requirements →

Match the host before the resolution

Verify that the processor or controller supports the exact 1280×800 timing, LVDS mapping, 6/8-bit mode, voltage rails and 40-pin connection. The LVDS integration guide explains why the source, cable, connector and panel must be validated as one link.

Check the complete front stack

This configuration is documented with PCAP and optical bonding. Confirm the ILI2511 controller interface, touch FPC route, cover outline, bezel overlap and intended finger, glove, water and EMC conditions during sample validation.

Use assembly dimensions for the enclosure

The documented 260.00×170.00×6.95 mm outline describes the module assembly. Use the current approved drawing—not the diagonal size—to release the opening, supports, connector access, FPC bend and keep-outs.

Compare pixel density and interface load

If the UI needs 1920×1200, compare DS-T101BFHA-01CP. It has 2.25 times as many pixels and a different documented LVDS connector/interface, so host capability and mechanical fit must be checked again.

Need a display without integrated touch? Compare the separately documented DS-T101HIEWA-01 base module at 1000 cd/m². Its outline and front stack differ from this 850 cd/m² CP assembly; do not treat the two as drop-in substitutes.

Product questions

DS-T101HIEWA-01CP FAQ

What host interface does DS-T101HIEWA-01CP use?

The documented module interface is LVDS 6/8-bit with a 40-pin connector. Confirm the current pinout, timing, mapping and electrical limits before design-in; the interface name alone does not establish compatibility.

Does DS-T101HIEWA-01CP include touch and optical bonding?

Yes. This verified configuration uses PCAP touch with an ILI2511 touch controller and optical bonding. Review the PCAP selection guide and validate the assembled touch stack in the actual use conditions.

What are the assembly dimensions of DS-T101HIEWA-01CP?

The documented module outline is 260.00×170.00×6.95 mm, and the active area is 216.96×135.60 mm. Use the current approved drawing for tolerances, mounting details and keep-out zones.

How does this 1280×800 model differ from the 1920×1200 10.1-inch option?

This model is documented at 1280×800, 850 cd/m² and LVDS 6/8-bit 40-pin. The separate DS-T101BFHA-01CP is documented at 1920×1200, 1000 cd/m² and dual-channel 8-bit LVDS 45-pin. Compare host bandwidth, pinout, temperature range, stack thickness and thermal conditions before choosing.

Review DS-T101HIEWA-01CP against your project.

Send the host platform, enclosure constraints, target quantity, touch environment and viewing conditions for a fit review.

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